Coverart for item
The Resource Electronic and photonics packaging ; : Multi-scale electrical and mechanical systems : 2006 : presented at 2006 ASME International Mechanical Engineering Congress and Exposition, November 5-10, 2006, Chicago, Illinois, USA, sponsored by the Electronic and Photonic Packaging Division, ASME

Electronic and photonics packaging ; : Multi-scale electrical and mechanical systems : 2006 : presented at 2006 ASME International Mechanical Engineering Congress and Exposition, November 5-10, 2006, Chicago, Illinois, USA, sponsored by the Electronic and Photonic Packaging Division, ASME

Label
Electronic and photonics packaging ; : Multi-scale electrical and mechanical systems : 2006 : presented at 2006 ASME International Mechanical Engineering Congress and Exposition, November 5-10, 2006, Chicago, Illinois, USA
Title
Electronic and photonics packaging ;
Title remainder
Multi-scale electrical and mechanical systems : 2006 : presented at 2006 ASME International Mechanical Engineering Congress and Exposition, November 5-10, 2006, Chicago, Illinois, USA
Statement of responsibility
sponsored by the Electronic and Photonic Packaging Division, ASME
Title variation
  • Proceedings of IMECE2006
  • Electronic and photonics packaging 2006
  • Multi-scale electrical and mechanical systems 2006
  • IMECE2006
  • Electronic and photonic packaging 2006
Contributor
Subject
Genre
Language
eng
Member of
Cataloging source
LHL
Illustrations
illustrations
Index
index present
LC call number
TK7870.15
LC item number
.E395 2007
Literary form
non fiction
Nature of contents
bibliography
http://library.link/vocab/relatedWorkOrContributorDate
2006
http://library.link/vocab/relatedWorkOrContributorName
  • American Society of Mechanical Engineers
  • International Mechanical Engineering Congress and Exposition
Series statement
EPP
Series volume
v. 6
http://library.link/vocab/subjectName
  • Electronic packaging
  • Microelectronic packaging
  • Microelectromechanical systems
  • Photonic crystals
  • Electronics
  • Nanotechnology
Label
Electronic and photonics packaging ; : Multi-scale electrical and mechanical systems : 2006 : presented at 2006 ASME International Mechanical Engineering Congress and Exposition, November 5-10, 2006, Chicago, Illinois, USA, sponsored by the Electronic and Photonic Packaging Division, ASME
Instantiates
Publication
Note
"Quality and reliability of electronic/photonics packaging, MEMS/NEMS packaging, MEMS/NEMS novel materials and structures, Ecoelectronics."
Bibliography note
Includes bibliographical references and author index
Carrier category
volume
Carrier category code
  • nc
Carrier MARC source
rdacarrier
Content category
text
Content type code
  • txt
Content type MARC source
rdacontent
Contents
2006 ASME MEMS/NEMS Packaging Symposium -- Symposium on Ecoelectronics -- Symposium on Novel Nano/Micro Materials and Structures for Electronic/Photonic Packaging -- Symposium on Quality and Reliability of Electronic/Photonic Packaging -- Multi-scale electrical and mechanical systems
Control code
133095070
Dimensions
28 cm
Extent
xix, 526 pages
Isbn
9780791847695
Media category
unmediated
Media MARC source
rdamedia
Media type code
  • n
Other physical details
illustrations
System control number
(OCoLC)133095070
Label
Electronic and photonics packaging ; : Multi-scale electrical and mechanical systems : 2006 : presented at 2006 ASME International Mechanical Engineering Congress and Exposition, November 5-10, 2006, Chicago, Illinois, USA, sponsored by the Electronic and Photonic Packaging Division, ASME
Publication
Note
"Quality and reliability of electronic/photonics packaging, MEMS/NEMS packaging, MEMS/NEMS novel materials and structures, Ecoelectronics."
Bibliography note
Includes bibliographical references and author index
Carrier category
volume
Carrier category code
  • nc
Carrier MARC source
rdacarrier
Content category
text
Content type code
  • txt
Content type MARC source
rdacontent
Contents
2006 ASME MEMS/NEMS Packaging Symposium -- Symposium on Ecoelectronics -- Symposium on Novel Nano/Micro Materials and Structures for Electronic/Photonic Packaging -- Symposium on Quality and Reliability of Electronic/Photonic Packaging -- Multi-scale electrical and mechanical systems
Control code
133095070
Dimensions
28 cm
Extent
xix, 526 pages
Isbn
9780791847695
Media category
unmediated
Media MARC source
rdamedia
Media type code
  • n
Other physical details
illustrations
System control number
(OCoLC)133095070

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