Coverart for item
The Resource ISTFA 2012 : conference proceedings from the 38th International Symposium for Testing and Failure Analysis : November 11-15, 2012, Phoenix Convention Center, Phoenix, Arizona, USA

ISTFA 2012 : conference proceedings from the 38th International Symposium for Testing and Failure Analysis : November 11-15, 2012, Phoenix Convention Center, Phoenix, Arizona, USA

Label
ISTFA 2012 : conference proceedings from the 38th International Symposium for Testing and Failure Analysis : November 11-15, 2012, Phoenix Convention Center, Phoenix, Arizona, USA
Title
ISTFA 2012
Title remainder
conference proceedings from the 38th International Symposium for Testing and Failure Analysis : November 11-15, 2012, Phoenix Convention Center, Phoenix, Arizona, USA
Creator
Subject
Genre
Language
eng
Member of
Cataloging source
E7B
Dewey number
621.381
Illustrations
  • illustrations
  • charts
Index
index present
LC call number
TK7801
LC item number
.I58 2012eb
Literary form
non fiction
http://bibfra.me/vocab/lite/meetingDate
2012
http://bibfra.me/vocab/lite/meetingName
International Symposium for Testing and Failure Analysis
Nature of contents
  • dictionaries
  • bibliography
http://library.link/vocab/subjectName
  • Electronics
  • Electronic apparatus and appliances
  • TECHNOLOGY & ENGINEERING
  • Electronic apparatus and appliances
  • Electronics
Label
ISTFA 2012 : conference proceedings from the 38th International Symposium for Testing and Failure Analysis : November 11-15, 2012, Phoenix Convention Center, Phoenix, Arizona, USA
Instantiates
Publication
Bibliography note
Includes bibliographical references and index
Carrier category
online resource
Carrier category code
  • cr
Carrier MARC source
rdacarrier
Color
multicolored
Content category
text
Content type code
  • txt
Content type MARC source
rdacontent
Contents
  • Title Page -- Copyright -- Board of Directors -- Organizing Committee -- Symposium Committee -- User Groups -- Contents -- 2012 IPFA Best Paper -- Laser Voltage Probing in Failure Analysis of Advanced Integrated Circuits on SOI -- Emerging Concepts and Techniques -- Closer to the Theoretical Limit: Spherical Corrections to Aplanatic Solid Immersion Imaging with Adaptive Optics -- Fault Isolation of Open Defects Using Space Domain Reflectometry -- Localization of Dead Open in a Solder Bump by Space Domain Reflectometry
  • Advanced Fault Isolation Technique Using Electro-Optical Terahertz Pulse Reflectometry (EOTPR) for 2D and 2.5D Flip-Chip PackageNovel Plasma FIB/SEM for High Speed Failure Analysis and Real Time Imaging of Large Volume Removal -- FemtoFarad/TeraOhm Endpoint Detection for Microsurgery of Integrated Circuit Devices -- Fault Isolation and Failure Analysis of TSV -- Cross Section Analysis of Cu Filled TSVs Based On High Throughput Plasma- FIB Milling -- Microstructural Considerations on the Reliability of 3D Packaging
  • High-Frequency TSV Failure Detection Method with Z ParameterEnhanced Failure Analysis on Open TSV Interconnects -- Nanoprobing Techniques -- A New Technique for Non-Invasive Short-Localisation in Thin Dielectric Layers by Electron Beam Absorbed Current (EBAC) Imaging -- Precise Localization of 28 nm via Chain Resistive Defect Using EBAC and Nanoprobing -- In FAB 300 mm Wafer Level Atomic Force Probe Characterization -- Nanoelectronic Analog Circuit PFA â€? The Return of Circuit Level Probing -- Fault Isolation and Failure Analysis of 3D Packages
  • Enhanced Comparison of Lock-in Thermography and Magnetic Microscopy for 3D Defect Localization of System in PackagesNon Destructive Failure Analysis of 3D Electronic Packages Using Both Electro Optical Terahertz Pulse Reflectometry and 3D X-ray Computed Tomography -- Failure Analysis Using Scanning Acoustic Microscopy for Diagnostics of Electronic Devices and 3D System Integration Technologies -- Nanoprobing Applications -- Analysis of an Anomalous Transistor Exhibiting Dual-Vt Characteristics and Its Cause in a 90 nm Node CMOS Technology
  • Study of Static Noise Margin, Cell Stability and Influence of Electron Beam on Sub-30 nm SRAM Using SEM-Based Nanoprobing with 8 NanoprobesLeaky Device Channel Anomaly Identification and Case Study by Nano-Probing Technique, Curve Fitting, and Model Analysis -- Photon Based Techniques: An Understanding -- Photon Emission Spectra of FETs as Obtained by InGaAs Detector -- Near-Infrared Photon Emission Spectroscopy Trends in Scaled SOI Technologies
Control code
823729131
Dimensions
unknown
Extent
1 online resource (xxi, 620 pages)
Form of item
online
Isbn
9781680155129
Media category
computer
Media MARC source
rdamedia
Media type code
  • c
Other physical details
illustrations (some color)
Specific material designation
remote
System control number
(OCoLC)823729131
Label
ISTFA 2012 : conference proceedings from the 38th International Symposium for Testing and Failure Analysis : November 11-15, 2012, Phoenix Convention Center, Phoenix, Arizona, USA
Publication
Bibliography note
Includes bibliographical references and index
Carrier category
online resource
Carrier category code
  • cr
Carrier MARC source
rdacarrier
Color
multicolored
Content category
text
Content type code
  • txt
Content type MARC source
rdacontent
Contents
  • Title Page -- Copyright -- Board of Directors -- Organizing Committee -- Symposium Committee -- User Groups -- Contents -- 2012 IPFA Best Paper -- Laser Voltage Probing in Failure Analysis of Advanced Integrated Circuits on SOI -- Emerging Concepts and Techniques -- Closer to the Theoretical Limit: Spherical Corrections to Aplanatic Solid Immersion Imaging with Adaptive Optics -- Fault Isolation of Open Defects Using Space Domain Reflectometry -- Localization of Dead Open in a Solder Bump by Space Domain Reflectometry
  • Advanced Fault Isolation Technique Using Electro-Optical Terahertz Pulse Reflectometry (EOTPR) for 2D and 2.5D Flip-Chip PackageNovel Plasma FIB/SEM for High Speed Failure Analysis and Real Time Imaging of Large Volume Removal -- FemtoFarad/TeraOhm Endpoint Detection for Microsurgery of Integrated Circuit Devices -- Fault Isolation and Failure Analysis of TSV -- Cross Section Analysis of Cu Filled TSVs Based On High Throughput Plasma- FIB Milling -- Microstructural Considerations on the Reliability of 3D Packaging
  • High-Frequency TSV Failure Detection Method with Z ParameterEnhanced Failure Analysis on Open TSV Interconnects -- Nanoprobing Techniques -- A New Technique for Non-Invasive Short-Localisation in Thin Dielectric Layers by Electron Beam Absorbed Current (EBAC) Imaging -- Precise Localization of 28 nm via Chain Resistive Defect Using EBAC and Nanoprobing -- In FAB 300 mm Wafer Level Atomic Force Probe Characterization -- Nanoelectronic Analog Circuit PFA â€? The Return of Circuit Level Probing -- Fault Isolation and Failure Analysis of 3D Packages
  • Enhanced Comparison of Lock-in Thermography and Magnetic Microscopy for 3D Defect Localization of System in PackagesNon Destructive Failure Analysis of 3D Electronic Packages Using Both Electro Optical Terahertz Pulse Reflectometry and 3D X-ray Computed Tomography -- Failure Analysis Using Scanning Acoustic Microscopy for Diagnostics of Electronic Devices and 3D System Integration Technologies -- Nanoprobing Applications -- Analysis of an Anomalous Transistor Exhibiting Dual-Vt Characteristics and Its Cause in a 90 nm Node CMOS Technology
  • Study of Static Noise Margin, Cell Stability and Influence of Electron Beam on Sub-30 nm SRAM Using SEM-Based Nanoprobing with 8 NanoprobesLeaky Device Channel Anomaly Identification and Case Study by Nano-Probing Technique, Curve Fitting, and Model Analysis -- Photon Based Techniques: An Understanding -- Photon Emission Spectra of FETs as Obtained by InGaAs Detector -- Near-Infrared Photon Emission Spectroscopy Trends in Scaled SOI Technologies
Control code
823729131
Dimensions
unknown
Extent
1 online resource (xxi, 620 pages)
Form of item
online
Isbn
9781680155129
Media category
computer
Media MARC source
rdamedia
Media type code
  • c
Other physical details
illustrations (some color)
Specific material designation
remote
System control number
(OCoLC)823729131

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