Coverart for item
The Resource Lead-free solders, JAI guest editor, Narayan Prabu

Lead-free solders, JAI guest editor, Narayan Prabu

Label
Lead-free solders
Title
Lead-free solders
Statement of responsibility
JAI guest editor, Narayan Prabu
Contributor
Subject
Language
eng
Summary
"Eleven peer-reviewed papers address the environmental and health concerns related to the exposure to lead during soldering and the success and failures of lead-free solders. Topics cover: Factors affecting the wetting behavior of solders and evolution of interfacial microstructure ; Pb-free high temperature solders for power semiconductor devices ; Effect of surface roughness on wetting behavior and evolution of microstructure of two lead free solders on copper substrates ; Fatigue life of SnBi Finished thin-small-outline-package (TSOP) parts under thermal cycling ; Microstructural aspects of the ductile-to-brittle transition ; Loading mixity on the interfacial failure mode in lead-free solder joint ; Solder joint strengths of BGA (Ball Grid Array) lead-free to that of eutectic lead (Sn-Pb) solder joint strengths. ; Effect of the morphology of Cu6Sn5 intermetallic compound on tensile properties of bulk solder and solder joint ; Tensile properties of Sn-10Sb-5Cu high temperature lead free solder ; Empirical modeling and rheological characterization of solder pastes used in electronic assemblies. STP 1530 is a valuable resource for students, researchers, and material scientists in the electronic industry."--Publisher's website
Member of
Cataloging source
KNOVL
Dewey number
621.9/77
Illustrations
illustrations
Index
no index present
Language note
English
LC call number
TK7836
LC item number
.L424 2011eb
Literary form
non fiction
NAL call number
TK7836
Nature of contents
  • dictionaries
  • bibliography
http://library.link/vocab/relatedWorkOrContributorName
  • Prabhu, Narayan
  • ASTM Committee D-2 on Petroleum Products and Lubricants
Series statement
Journal of ASTM International selected technical papers
Series volume
STP1530
http://library.link/vocab/subjectName
  • Lead-free electronics manufacturing processes
  • Solder and soldering
  • Lead-free electronics manufacturing processes
  • Electrical & Computer Engineering
  • Engineering & Applied Sciences
  • Electrical Engineering
Label
Lead-free solders, JAI guest editor, Narayan Prabu
Instantiates
Publication
Note
"Sponsored by ASTM Committee D02 on Petroleum Products and Lubricants"--Page [iii]
Antecedent source
unknown
Bibliography note
Includes bibliographical references
Carrier category
online resource
Carrier category code
  • cr
Carrier MARC source
rdacarrier
Color
multicolored
Content category
text
Content type code
  • txt
Content type MARC source
rdacontent
Contents
Wetting behavior of solders / G. Kumar, K. Narayan Prabhu -- A review of Pb-free High-temperature solders for power-semiconductor devices; Bi-base composite solder and Zn-Al-base solders / Y. Takakul, I. Ohnuma, Y. Yamada, Y. Yagi, I. Nakagawa, T. Atsumi, M. Shirai, K. Ishida -- Wetting behavior and evolution of microstructure of Sn-Ag-Zn solders on copper substrates with different surface textures / S. Narayan, K. Narayan Prabhu -- Solders joint reliability of SnBi finished TSOPs with Alloy 42 lead-frame under temperature cycling / W. Wang, M. Osterman, D. Das, M. Pecht -- The microstructural aspect of the ductile-to-brittle transition of tin-based lead-free solders / K. Lambrinou, W. Engelmaier -- Loading mixity on the interfacial failure mode in lead-free solder joint / F. Gao, J. Jing, F.Z, Liang, R.L. Williams, J. Qu -- Ball grid array lead-free solder joint strength under monotonic flexural load / P. Geng -- Tensile properties of Sn-10Sb-5Cu high temperature lead free solder / Q. Zeng, J. Guo, X. Gu, Q. Zhu, X. Liu -- Empirical modeling of the time-dependent structural build-up of lead-free solder pastes used in the electronics assembly applications / S. Mallik, N.N. Ekere, R. Bhatti -- Rheological characterization and empirical modeling of lead-free solder pastes and isotropic conductive adhesive (ICA) pastes / R. Durairaj, L.W. Man, S. Ramesh
Control code
853660052
Dimensions
unknown
Extent
1 online resource (viii, 203 pages)
File format
unknown
Form of item
online
Isbn
9781621987383
Level of compression
unknown
Media category
computer
Media MARC source
rdamedia
Media type code
  • c
Other control number
10.1520/STP1530-EB
Other physical details
illustrations
http://library.link/vocab/ext/overdrive/overdriveId
stp1530-eb
Quality assurance targets
not applicable
Reformatting quality
unknown
Sound
unknown sound
Specific material designation
remote
System control number
(OCoLC)853660052
Label
Lead-free solders, JAI guest editor, Narayan Prabu
Publication
Note
"Sponsored by ASTM Committee D02 on Petroleum Products and Lubricants"--Page [iii]
Antecedent source
unknown
Bibliography note
Includes bibliographical references
Carrier category
online resource
Carrier category code
  • cr
Carrier MARC source
rdacarrier
Color
multicolored
Content category
text
Content type code
  • txt
Content type MARC source
rdacontent
Contents
Wetting behavior of solders / G. Kumar, K. Narayan Prabhu -- A review of Pb-free High-temperature solders for power-semiconductor devices; Bi-base composite solder and Zn-Al-base solders / Y. Takakul, I. Ohnuma, Y. Yamada, Y. Yagi, I. Nakagawa, T. Atsumi, M. Shirai, K. Ishida -- Wetting behavior and evolution of microstructure of Sn-Ag-Zn solders on copper substrates with different surface textures / S. Narayan, K. Narayan Prabhu -- Solders joint reliability of SnBi finished TSOPs with Alloy 42 lead-frame under temperature cycling / W. Wang, M. Osterman, D. Das, M. Pecht -- The microstructural aspect of the ductile-to-brittle transition of tin-based lead-free solders / K. Lambrinou, W. Engelmaier -- Loading mixity on the interfacial failure mode in lead-free solder joint / F. Gao, J. Jing, F.Z, Liang, R.L. Williams, J. Qu -- Ball grid array lead-free solder joint strength under monotonic flexural load / P. Geng -- Tensile properties of Sn-10Sb-5Cu high temperature lead free solder / Q. Zeng, J. Guo, X. Gu, Q. Zhu, X. Liu -- Empirical modeling of the time-dependent structural build-up of lead-free solder pastes used in the electronics assembly applications / S. Mallik, N.N. Ekere, R. Bhatti -- Rheological characterization and empirical modeling of lead-free solder pastes and isotropic conductive adhesive (ICA) pastes / R. Durairaj, L.W. Man, S. Ramesh
Control code
853660052
Dimensions
unknown
Extent
1 online resource (viii, 203 pages)
File format
unknown
Form of item
online
Isbn
9781621987383
Level of compression
unknown
Media category
computer
Media MARC source
rdamedia
Media type code
  • c
Other control number
10.1520/STP1530-EB
Other physical details
illustrations
http://library.link/vocab/ext/overdrive/overdriveId
stp1530-eb
Quality assurance targets
not applicable
Reformatting quality
unknown
Sound
unknown sound
Specific material designation
remote
System control number
(OCoLC)853660052

Library Locations

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      400 West 14th Street, Rolla, MO, 65409, US
      37.955220 -91.772210
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