The Resource Lead-free solders, JAI guest editor, Narayan Prabu
Lead-free solders, JAI guest editor, Narayan Prabu
Resource Information
The item Lead-free solders, JAI guest editor, Narayan Prabu represents a specific, individual, material embodiment of a distinct intellectual or artistic creation found in Missouri University of Science & Technology Library.This item is available to borrow from 1 library branch.
Resource Information
The item Lead-free solders, JAI guest editor, Narayan Prabu represents a specific, individual, material embodiment of a distinct intellectual or artistic creation found in Missouri University of Science & Technology Library.
This item is available to borrow from 1 library branch.
- Summary
- "Eleven peer-reviewed papers address the environmental and health concerns related to the exposure to lead during soldering and the success and failures of lead-free solders. Topics cover: Factors affecting the wetting behavior of solders and evolution of interfacial microstructure ; Pb-free high temperature solders for power semiconductor devices ; Effect of surface roughness on wetting behavior and evolution of microstructure of two lead free solders on copper substrates ; Fatigue life of SnBi Finished thin-small-outline-package (TSOP) parts under thermal cycling ; Microstructural aspects of the ductile-to-brittle transition ; Loading mixity on the interfacial failure mode in lead-free solder joint ; Solder joint strengths of BGA (Ball Grid Array) lead-free to that of eutectic lead (Sn-Pb) solder joint strengths. ; Effect of the morphology of Cu6Sn5 intermetallic compound on tensile properties of bulk solder and solder joint ; Tensile properties of Sn-10Sb-5Cu high temperature lead free solder ; Empirical modeling and rheological characterization of solder pastes used in electronic assemblies. STP 1530 is a valuable resource for students, researchers, and material scientists in the electronic industry."--Publisher's website
- Language
- eng
- Extent
- 1 online resource (viii, 203 pages)
- Note
- "Sponsored by ASTM Committee D02 on Petroleum Products and Lubricants"--Page iii
- Contents
-
- Wetting behavior of solders / G. Kumar, K. Narayan Prabhu
- A review of Pb-free High-temperature solders for power-semiconductor devices; Bi-base composite solder and Zn-Al-base solders / Y. Takakul, I. Ohnuma, Y. Yamada, Y. Yagi, I. Nakagawa, T. Atsumi, M. Shirai, K. Ishida
- Wetting behavior and evolution of microstructure of Sn-Ag-Zn solders on copper substrates with different surface textures / S. Narayan, K. Narayan Prabhu
- Solders joint reliability of SnBi finished TSOPs with Alloy 42 lead-frame under temperature cycling / W. Wang, M. Osterman, D. Das, M. Pecht
- The microstructural aspect of the ductile-to-brittle transition of tin-based lead-free solders / K. Lambrinou, W. Engelmaier
- Loading mixity on the interfacial failure mode in lead-free solder joint / F. Gao, J. Jing, F.Z, Liang, R.L. Williams, J. Qu
- Ball grid array lead-free solder joint strength under monotonic flexural load / P. Geng
- Tensile properties of Sn-10Sb-5Cu high temperature lead free solder / Q. Zeng, J. Guo, X. Gu, Q. Zhu, X. Liu
- Empirical modeling of the time-dependent structural build-up of lead-free solder pastes used in the electronics assembly applications / S. Mallik, N.N. Ekere, R. Bhatti
- Rheological characterization and empirical modeling of lead-free solder pastes and isotropic conductive adhesive (ICA) pastes / R. Durairaj, L.W. Man, S. Ramesh
- Isbn
- 9781621987383
- Label
- Lead-free solders
- Title
- Lead-free solders
- Statement of responsibility
- JAI guest editor, Narayan Prabu
- Language
- eng
- Summary
- "Eleven peer-reviewed papers address the environmental and health concerns related to the exposure to lead during soldering and the success and failures of lead-free solders. Topics cover: Factors affecting the wetting behavior of solders and evolution of interfacial microstructure ; Pb-free high temperature solders for power semiconductor devices ; Effect of surface roughness on wetting behavior and evolution of microstructure of two lead free solders on copper substrates ; Fatigue life of SnBi Finished thin-small-outline-package (TSOP) parts under thermal cycling ; Microstructural aspects of the ductile-to-brittle transition ; Loading mixity on the interfacial failure mode in lead-free solder joint ; Solder joint strengths of BGA (Ball Grid Array) lead-free to that of eutectic lead (Sn-Pb) solder joint strengths. ; Effect of the morphology of Cu6Sn5 intermetallic compound on tensile properties of bulk solder and solder joint ; Tensile properties of Sn-10Sb-5Cu high temperature lead free solder ; Empirical modeling and rheological characterization of solder pastes used in electronic assemblies. STP 1530 is a valuable resource for students, researchers, and material scientists in the electronic industry."--Publisher's website
- Cataloging source
- KNOVL
- Dewey number
- 621.9/77
- Illustrations
- illustrations
- Index
- no index present
- Language note
- English
- LC call number
- TK7836
- LC item number
- .L424 2011eb
- Literary form
- non fiction
- NAL call number
- TK7836
- Nature of contents
-
- dictionaries
- bibliography
- http://library.link/vocab/relatedWorkOrContributorName
-
- Prabhu, Narayan
- ASTM Committee D-2 on Petroleum Products and Lubricants
- Series statement
- Journal of ASTM International selected technical papers
- Series volume
- STP1530
- http://library.link/vocab/subjectName
-
- Lead-free electronics manufacturing processes
- Solder and soldering
- Lead-free electronics manufacturing processes
- Label
- Lead-free solders, JAI guest editor, Narayan Prabu
- Note
- "Sponsored by ASTM Committee D02 on Petroleum Products and Lubricants"--Page iii
- Antecedent source
- unknown
- Bibliography note
- Includes bibliographical references
- Carrier category
- online resource
- Carrier category code
-
- cr
- Carrier MARC source
- rdacarrier
- Color
- multicolored
- Content category
- text
- Content type code
-
- txt
- Content type MARC source
- rdacontent
- Contents
- Wetting behavior of solders / G. Kumar, K. Narayan Prabhu -- A review of Pb-free High-temperature solders for power-semiconductor devices; Bi-base composite solder and Zn-Al-base solders / Y. Takakul, I. Ohnuma, Y. Yamada, Y. Yagi, I. Nakagawa, T. Atsumi, M. Shirai, K. Ishida -- Wetting behavior and evolution of microstructure of Sn-Ag-Zn solders on copper substrates with different surface textures / S. Narayan, K. Narayan Prabhu -- Solders joint reliability of SnBi finished TSOPs with Alloy 42 lead-frame under temperature cycling / W. Wang, M. Osterman, D. Das, M. Pecht -- The microstructural aspect of the ductile-to-brittle transition of tin-based lead-free solders / K. Lambrinou, W. Engelmaier -- Loading mixity on the interfacial failure mode in lead-free solder joint / F. Gao, J. Jing, F.Z, Liang, R.L. Williams, J. Qu -- Ball grid array lead-free solder joint strength under monotonic flexural load / P. Geng -- Tensile properties of Sn-10Sb-5Cu high temperature lead free solder / Q. Zeng, J. Guo, X. Gu, Q. Zhu, X. Liu -- Empirical modeling of the time-dependent structural build-up of lead-free solder pastes used in the electronics assembly applications / S. Mallik, N.N. Ekere, R. Bhatti -- Rheological characterization and empirical modeling of lead-free solder pastes and isotropic conductive adhesive (ICA) pastes / R. Durairaj, L.W. Man, S. Ramesh
- Control code
- 853660052
- Dimensions
- unknown
- Extent
- 1 online resource (viii, 203 pages)
- File format
- unknown
- Form of item
- online
- Isbn
- 9781621987383
- Level of compression
- unknown
- Media category
- computer
- Media MARC source
- rdamedia
- Media type code
-
- c
- Other control number
- 10.1520/STP1530-EB
- Other physical details
- illustrations
- http://library.link/vocab/ext/overdrive/overdriveId
- stp1530-eb
- Quality assurance targets
- not applicable
- Reformatting quality
- unknown
- Sound
- unknown sound
- Specific material designation
- remote
- System control number
- (OCoLC)853660052
- Label
- Lead-free solders, JAI guest editor, Narayan Prabu
- Note
- "Sponsored by ASTM Committee D02 on Petroleum Products and Lubricants"--Page iii
- Antecedent source
- unknown
- Bibliography note
- Includes bibliographical references
- Carrier category
- online resource
- Carrier category code
-
- cr
- Carrier MARC source
- rdacarrier
- Color
- multicolored
- Content category
- text
- Content type code
-
- txt
- Content type MARC source
- rdacontent
- Contents
- Wetting behavior of solders / G. Kumar, K. Narayan Prabhu -- A review of Pb-free High-temperature solders for power-semiconductor devices; Bi-base composite solder and Zn-Al-base solders / Y. Takakul, I. Ohnuma, Y. Yamada, Y. Yagi, I. Nakagawa, T. Atsumi, M. Shirai, K. Ishida -- Wetting behavior and evolution of microstructure of Sn-Ag-Zn solders on copper substrates with different surface textures / S. Narayan, K. Narayan Prabhu -- Solders joint reliability of SnBi finished TSOPs with Alloy 42 lead-frame under temperature cycling / W. Wang, M. Osterman, D. Das, M. Pecht -- The microstructural aspect of the ductile-to-brittle transition of tin-based lead-free solders / K. Lambrinou, W. Engelmaier -- Loading mixity on the interfacial failure mode in lead-free solder joint / F. Gao, J. Jing, F.Z, Liang, R.L. Williams, J. Qu -- Ball grid array lead-free solder joint strength under monotonic flexural load / P. Geng -- Tensile properties of Sn-10Sb-5Cu high temperature lead free solder / Q. Zeng, J. Guo, X. Gu, Q. Zhu, X. Liu -- Empirical modeling of the time-dependent structural build-up of lead-free solder pastes used in the electronics assembly applications / S. Mallik, N.N. Ekere, R. Bhatti -- Rheological characterization and empirical modeling of lead-free solder pastes and isotropic conductive adhesive (ICA) pastes / R. Durairaj, L.W. Man, S. Ramesh
- Control code
- 853660052
- Dimensions
- unknown
- Extent
- 1 online resource (viii, 203 pages)
- File format
- unknown
- Form of item
- online
- Isbn
- 9781621987383
- Level of compression
- unknown
- Media category
- computer
- Media MARC source
- rdamedia
- Media type code
-
- c
- Other control number
- 10.1520/STP1530-EB
- Other physical details
- illustrations
- http://library.link/vocab/ext/overdrive/overdriveId
- stp1530-eb
- Quality assurance targets
- not applicable
- Reformatting quality
- unknown
- Sound
- unknown sound
- Specific material designation
- remote
- System control number
- (OCoLC)853660052
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<div class="citation" vocab="http://schema.org/"><i class="fa fa-external-link-square fa-fw"></i> Data from <span resource="http://link.library.mst.edu/portal/Lead-free-solders-JAI-guest-editor-Narayan/muA3Fu20b28/" typeof="Book http://bibfra.me/vocab/lite/Item"><span property="name http://bibfra.me/vocab/lite/label"><a href="http://link.library.mst.edu/portal/Lead-free-solders-JAI-guest-editor-Narayan/muA3Fu20b28/">Lead-free solders, JAI guest editor, Narayan Prabu</a></span> - <span property="potentialAction" typeOf="OrganizeAction"><span property="agent" typeof="LibrarySystem http://library.link/vocab/LibrarySystem" resource="http://link.library.mst.edu/"><span property="name http://bibfra.me/vocab/lite/label"><a property="url" href="http://link.library.mst.edu/">Missouri University of Science & Technology Library</a></span></span></span></span></div>
