Lead-free solders
Resource Information
The work Lead-free solders represents a distinct intellectual or artistic creation found in Missouri University of Science & Technology Library. This resource is a combination of several types including: Work, Language Material, Books.
The Resource
Lead-free solders
Resource Information
The work Lead-free solders represents a distinct intellectual or artistic creation found in Missouri University of Science & Technology Library. This resource is a combination of several types including: Work, Language Material, Books.
- Label
- Lead-free solders
- Statement of responsibility
- JAI guest editor, Narayan Prabu
- Language
- eng
- Summary
- "Eleven peer-reviewed papers address the environmental and health concerns related to the exposure to lead during soldering and the success and failures of lead-free solders. Topics cover: Factors affecting the wetting behavior of solders and evolution of interfacial microstructure ; Pb-free high temperature solders for power semiconductor devices ; Effect of surface roughness on wetting behavior and evolution of microstructure of two lead free solders on copper substrates ; Fatigue life of SnBi Finished thin-small-outline-package (TSOP) parts under thermal cycling ; Microstructural aspects of the ductile-to-brittle transition ; Loading mixity on the interfacial failure mode in lead-free solder joint ; Solder joint strengths of BGA (Ball Grid Array) lead-free to that of eutectic lead (Sn-Pb) solder joint strengths. ; Effect of the morphology of Cu6Sn5 intermetallic compound on tensile properties of bulk solder and solder joint ; Tensile properties of Sn-10Sb-5Cu high temperature lead free solder ; Empirical modeling and rheological characterization of solder pastes used in electronic assemblies. STP 1530 is a valuable resource for students, researchers, and material scientists in the electronic industry."--Publisher's website
- Cataloging source
- KNOVL
- Dewey number
- 621.9/77
- Illustrations
- illustrations
- Index
- no index present
- Language note
- English
- LC call number
- TK7836
- LC item number
- .L424 2011eb
- Literary form
- non fiction
- NAL call number
- TK7836
- Nature of contents
-
- dictionaries
- bibliography
- Series statement
- Journal of ASTM International selected technical papers
- Series volume
- STP1530
Context
Context of Lead-free soldersWork of
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<div class="citation" vocab="http://schema.org/"><i class="fa fa-external-link-square fa-fw"></i> Data from <span resource="http://link.library.mst.edu/resource/xkNodwjiiYQ/" typeof="CreativeWork http://bibfra.me/vocab/lite/Work"><span property="name http://bibfra.me/vocab/lite/label"><a href="http://link.library.mst.edu/resource/xkNodwjiiYQ/">Lead-free solders</a></span> - <span property="potentialAction" typeOf="OrganizeAction"><span property="agent" typeof="LibrarySystem http://library.link/vocab/LibrarySystem" resource="http://link.library.mst.edu/"><span property="name http://bibfra.me/vocab/lite/label"><a property="url" href="http://link.library.mst.edu/">Missouri University of Science & Technology Library</a></span></span></span></span></div>
